
|
絶縁部素材
(Insulation) |
誘電率
(Dielectric Constant) |
引張弾性率
(Tensile Modulus[GPa]) |
破壊伸び
(Elongation to Brreak) |
軟化温度
(Melting/Soften Temperature ) |
|
Parylene N
|
2.65
|
2.4
|
30
|
290℃
|
|
Parylene C
|
3.1
|
3.2
|
200
|
290℃
|
|
クォーツ
(Quartz) |
3.8
|
73
|
非常に弱い
|
1715℃
|
|
ボロシリケイト
(Borosilicate) |
4.6
|
62
|
*
|
820℃
|
|
エポキシ樹脂
(Epoxy) |
4.6
|
2.9
|
3.5
|
115℃
|